![a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram](https://www.researchgate.net/publication/289706872/figure/fig1/AS:319869900869632@1453274335320/a-Cu-wire-bonds-on-an-IGBT-9-b-a-DCB-substrate-with-Al-ribbons-10-and-c-a-Cu.png)
a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram
![Electronics | Free Full-Text | Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters Electronics | Free Full-Text | Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters](https://www.mdpi.com/electronics/electronics-11-01373/article_deploy/html/images/electronics-11-01373-g001.png)
Electronics | Free Full-Text | Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
![2 uds. Conector FPC interno de batería, Clip de contacto para Lenovo Vibe P1 P1c72 P1C58 P 1c72 X2 X2 TO X2 CU ZUK Z1 Z1221|Cables flexibles para teléfonos móviles| - AliExpress 2 uds. Conector FPC interno de batería, Clip de contacto para Lenovo Vibe P1 P1c72 P1C58 P 1c72 X2 X2 TO X2 CU ZUK Z1 Z1221|Cables flexibles para teléfonos móviles| - AliExpress](https://ae01.alicdn.com/kf/H3baea8e9973d489b8c8a049cb9630a64x.jpg)
2 uds. Conector FPC interno de batería, Clip de contacto para Lenovo Vibe P1 P1c72 P1C58 P 1c72 X2 X2 TO X2 CU ZUK Z1 Z1221|Cables flexibles para teléfonos móviles| - AliExpress
![Figure 2 from Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar Figure 2 from Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/98ebbb7ff06d45bc6f8bed1ed24351f510b74a22/2-Figure2-1.png)
Figure 2 from Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar
![Figure 1 from Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar Figure 1 from Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/98ebbb7ff06d45bc6f8bed1ed24351f510b74a22/2-Figure1-1.png)